与III-V通道的高k集成:高压溅射氧化钆与磷化铟的界面优化

E. San Andrés, M. Pampillón, C. Cañadilla, P. C. Feijoo, A. del Prado
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引用次数: 3

摘要

研究了高压溅射和等离子体氧化法制备铟磷表面的Gd2O3金属氧化物半导体器件的电学性能。所得到的器件显示出功能完备的电容曲线。表明一个未固定的费米能级。样品在温度高达550°C的成形气体中退火。我们研究了器件的界面阱密度。我们发现,随着退火温度的升高,缺陷含量减少,但在550℃时,电容下降,漏电流增加。,表示介电退化。
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Towards high-k integration with III-V channels: Interface optimization of high pressure sputtered gadolinium oxide on indium phospide
We studied the electrical properties of metal-oxide-semiconductor devices based on Gd2O3 deposited on InP by high pressure sputtering and a novel plasma oxidation process. The resulting devices show fully functional capacitance curves., indicating an unpinned Fermi level. The samples were annealed in forming gas at temperatures up to 550°C. We studied the interface trap density of the devices. We found out that with increasing annealing temperature the defect content decreases but at 550°C the capacitance drops and the leakage current increases., indicating a dielectric degradation.
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