F Lombardi , Z.G Ivanov, P Komissinski , G.M Fischer , P Larsson, T Claeson
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The influence of the top and the bottom grain boundaries on the current transport in YBa2Cu3O7-δ step-edge Josephson junction
We have studied the electrical transport properties of the grain boundaries (GBs) formed at the top and at the bottom edges of YBa2Cu3O7-δ step-edge Josephson junctions, for different values of the step angle α. The step-edge junctions were fabricated on (100) LaAlO3 steps using a tilted Ar ion milling. Due to the shadowing effect of the step, the middle and the bottom part of the step edge junction were contacted by thin stripes. We found that for α≈60° the top GB is responsible for the weak link behaviour of our step-edge junctions. On less steep steps, α≈45°, a series of GBs with weak link properties were found to nucleate along the step profile. We also correlated these results with the different microstructural properties of the GBs formed on steps with different angles.
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