多孔有机硅超低钾膜的无损伤低温刻蚀

{"title":"多孔有机硅超低钾膜的无损伤低温刻蚀","authors":"Liping Zhang, R. Ljazouli, P. Lefaucheux, T. Tillocher, R. Dussart, Y. Mankelevich, J. D. Marneffe, S. Gendt, M. Baklanov","doi":"10.1149/2.007302SSL","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":11627,"journal":{"name":"Electrochemical and Solid State Letters","volume":"19 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2012-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"Damage Free Cryogenic Etching of a Porous Organosilica Ultralow-k Film\",\"authors\":\"Liping Zhang, R. Ljazouli, P. Lefaucheux, T. Tillocher, R. Dussart, Y. Mankelevich, J. D. Marneffe, S. Gendt, M. Baklanov\",\"doi\":\"10.1149/2.007302SSL\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":11627,\"journal\":{\"name\":\"Electrochemical and Solid State Letters\",\"volume\":\"19 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrochemical and Solid State Letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1149/2.007302SSL\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrochemical and Solid State Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/2.007302SSL","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}