Birgit Brandstätter, B. Auer, H. Klingler, S. Scherbaum
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引用次数: 0
摘要
由液体表面张力驱动的组件自组装是传统高精度拾取和放置的一个有吸引力的补充,甚至是替代方案,因为它提供了高精度,尽管机器人零件放置不准确。虽然通过液体焊料的毛细管自对准是倒装芯片工艺的标准技术,但这项工作展示了在临时载体上的湿受体上的模具自对准:通过等离子体处理在临时载体上产生亲水性和疏水性部分,将低粘度液体喷射到每个受体上,其中包含液体。采用低精度取模方式对单个模具进行确定性送料,同时对批量的3个模具和9个模具进行优化,使设备达到最佳产量,实现高精度和高生产率。行业准备和全自动芯片到晶圆的拾取和放置过程被实施到扇形晶圆级封装生产流程中,证明自校准能够缓解该生产链中单个模具级步骤中扇形封装拾取和放置系统对机器人校准能力的严格要求。自对准过程进行了优化,失效模式,如不良的液体约束,表面污染,或过度的力被识别和消除。对于尺寸为3.1 mm × 3.1 mm的模具,每个点的键合精度均达到<3 μm @ 3 σ。使用平行模具处理,高速度每小时约10,000个单位是可能的。
High-Accuracy Pick-and-Place of Multiple Dies in Parallel Assisted by Capillary Self-Alignment
Self-assembly of components driven by liquid surface tension is an attractive complement and even alternative to traditional high-accuracy pick-and-place as it offers high accuracy despite inaccurate robotic part placement. While capillary self-alignment through liquid solder is the standard technology for flip-chip processes, this work presents self-alignment of dies on wetted receptors on a temporary carrier: Low-viscosity liquid is jetted on each receptor where the liquid is contained through generation of hydrophilic and hydrophobic sections on the temporary carrier by plasma treatment. Deterministic die feeding by low-accuracy pick-and-place is conducted for single dies, as well as for batches of three dies and nine dies optimizing the equipment for best throughput to achieve both high accuracy and high productivity. The industry-ready and fully automated chip-to-wafer pick-and-place process is implemented into a fan-out wafer-level packaging production flow proving that self-alignment is capable of easing the stringent requirement for robotic alignment capability for pick-and-place systems in fan-out packaging for the single die-level step in this production chain. The self-alignment process is optimized, and failure modes such as poor liquid confinement, surface contamination, or excess force are identified and eliminated. Post-bond accuracy of <3 μm @ 3 σ at each point of the die is reached for dies of 3.1 mm x 3.1 mm in size. Using parallel die handling, high speeds of around 10 000 units per hour are made possible.