{"title":"水平系统:下一代HDI生产的领先技术","authors":"S. Kenny, T. Magaya","doi":"10.1109/IMPACT.2009.5382265","DOIUrl":null,"url":null,"abstract":"The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"60 1","pages":"633-636"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Horizontal systems: Leading technology for next generation HDI production\",\"authors\":\"S. Kenny, T. Magaya\",\"doi\":\"10.1109/IMPACT.2009.5382265\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"60 1\",\"pages\":\"633-636\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382265\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Horizontal systems: Leading technology for next generation HDI production
The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.
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