Improved Performance of MoS2 FETs using AlN/Al2 O3 dielectric and Plasma Enhanced Atomic Layer Deposition (PEALD)

Molybdenum disulfide (MoS2 ) transistors are emerging as an exciting material system for future electronics due to their unique electrical properties, twodimensional (2D) nature and atomically thin geometry. This ultra-thin-body (UTB) semiconductor considerably reduces current leakage and enables gate-to-channel control. The homogeneous growth of sub-10 nm dielectrics on 2D materials remains challenging. We demonstrate high-performance MoS2 FETs at low temperature (150°C) using the plasma-enhanced Atomic layer deposition (PEALD) technique. The device exhibits a high on/off current ratio of about 106 , the field-effect mobility of 9.5 cm2 /Vs, and a subthreshold swing (SS) of 171 mV/dec, which is comparable to the similar structure of the top gate device. In addition, we have demonstrated contact resistance on back-gate MoS2 FETs with and without dielectric capping