用于下一代成像和通信应用的300 GHz低噪声放大器S-MMIC

A. Tessmann, A. Leuther, S. Wagner, H. Massler, M. Kuri, H. Stulz, M. Zink, M. Riessle, T. Merkle
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引用次数: 28

摘要

WR-3 (220-330 GHz)低噪声放大器(LNA)电路已开发用于下一代高分辨率成像应用和超高容量通信链路。亚毫米波单片集成电路(S-MMIC)采用35nm基于InAlAs/InGaAs的高电子迁移率晶体管(mHEMT)技术,结合接地共面波导拓扑结构(GCPW)和级联晶体管,实现了低噪声、高增益和大工作带宽。封装的LNA电路在314 GHz时的最大增益为29 dB,在252至330 GHz的频率范围内的最大增益超过26 dB。在280 ~ 330 GHz范围内测得平均室温(T = 293 K)噪声系数为6.5 dB。此外,LNA电路已用于实现非常紧凑的WR-3单片机接收模块,在工作频率下平均转换增益为6.5 dB,噪声系数为8.6 dB。
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A 300 GHz low-noise amplifier S-MMIC for use in next-generation imaging and communication applications
A WR-3 (220–330 GHz) low-noise amplifier (LNA) circuit has been developed for use in next-generation high resolution imaging applications and ultra-high capacity communication links. The submillimeter-wave monolithic integrated circuit (S-MMIC) was realized by using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide topology (GCPW) and cascode transistors, thus leading to a very low noise figure in combination with high gain and large operational bandwidth. The packaged LNA circuit achieved a maximum gain of 29 dB at 314 GHz and more than 26 dB in the frequency range from 252 to 330 GHz. An average room temperature (T = 293 K) noise figure of 6.5 dB was measured between 280 and 330 GHz. Furthermore, the LNA circuit has been used to realize a very compact WR-3 single-chip receiver module, demonstrating an average conversion gain of 6.5 dB and a noise figure of 8.6 dB at the frequency of operation.
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