AsH3等离子体浸没离子注入硅的模拟

A. Burenkov, J. Lorenz, Y. Spiegel, F. Torregrosa
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引用次数: 2

摘要

采用离子束服务公司的pusl工具将AsH3等离子体注入(100)晶体硅中。获得了最大浓度超过1×1022 cm-3、在1×1018 cm-3浓度下穿透深度小于10 nm的超浅砷掺杂谱。两个模拟模型被用来描述观察到的砷分布:一个是作者早期为BF3等离子体开发的模型,另一个是解释AsH3等离子体特征的新模型。
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Simulation of AsH3 plasma immersion ion implantation into silicon
Plasma immersion ion implantation from AsH3 plasma into (100) crystalline silicon was performed using the PULSION tool of Ion Beam Services. Ultra-shallow arsenic doping profiles with maximum concentrations in excess of 1×1022 cm-3 and penetration depths below 10 nm at a concentration of 1×1018 cm-3 were obtained. Two simulation models were applied to describe the observed arsenic profiles: the one developed by the authors earlier for BF3 plasma and a new one that accounts for the specifics of AsH3 plasma.
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