{"title":"不测量力或位移而测量脆性微梁的强度","authors":"A. Hirshberg, D. Elata","doi":"10.1109/ESIME.2006.1643990","DOIUrl":null,"url":null,"abstract":"A new test device for measuring strength of brittle microbeams was recently proposed. This test device requires no measurement of applied forces or of deformation. In this work, the theoretical analysis that explains how the strength of microbeams may be deduced from the length of the remaining ligament of broken beams is presented","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"70 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Measuring the Strength of Brittle Microbeams Without Measuring Forces or Displacements\",\"authors\":\"A. Hirshberg, D. Elata\",\"doi\":\"10.1109/ESIME.2006.1643990\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new test device for measuring strength of brittle microbeams was recently proposed. This test device requires no measurement of applied forces or of deformation. In this work, the theoretical analysis that explains how the strength of microbeams may be deduced from the length of the remaining ligament of broken beams is presented\",\"PeriodicalId\":60796,\"journal\":{\"name\":\"微纳电子与智能制造\",\"volume\":\"70 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"微纳电子与智能制造\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2006.1643990\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643990","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measuring the Strength of Brittle Microbeams Without Measuring Forces or Displacements
A new test device for measuring strength of brittle microbeams was recently proposed. This test device requires no measurement of applied forces or of deformation. In this work, the theoretical analysis that explains how the strength of microbeams may be deduced from the length of the remaining ligament of broken beams is presented
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