{"title":"利用H2共气改善氟基掺杂剂离子源稳定性","authors":"T. Hsieh, N. Colvin","doi":"10.1109/IIT.2014.6940042","DOIUrl":null,"url":null,"abstract":"Fluoride based gases are commonly used in the ion implantation. Gases such as GeF<sub>4</sub>, SiF<sub>4</sub> use as pre-amorphization species and BF<sub>3</sub> is for high dose p-type BF<sub>2</sub> and <sup>11</sup>Boron can be a productivity challenge for conventional ion implanters used for semi-conductor device applications. As device geometries continuously shrink, there is a trend to deliver higher beam currents at lower energies, with a corresponding reduction in particles and metal contamination.","PeriodicalId":6548,"journal":{"name":"2014 20th International Conference on Ion Implantation Technology (IIT)","volume":"31 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2014-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Improved ion source stability using H2 co-gas for fluoride based dopants\",\"authors\":\"T. Hsieh, N. Colvin\",\"doi\":\"10.1109/IIT.2014.6940042\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fluoride based gases are commonly used in the ion implantation. Gases such as GeF<sub>4</sub>, SiF<sub>4</sub> use as pre-amorphization species and BF<sub>3</sub> is for high dose p-type BF<sub>2</sub> and <sup>11</sup>Boron can be a productivity challenge for conventional ion implanters used for semi-conductor device applications. As device geometries continuously shrink, there is a trend to deliver higher beam currents at lower energies, with a corresponding reduction in particles and metal contamination.\",\"PeriodicalId\":6548,\"journal\":{\"name\":\"2014 20th International Conference on Ion Implantation Technology (IIT)\",\"volume\":\"31 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 20th International Conference on Ion Implantation Technology (IIT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIT.2014.6940042\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 20th International Conference on Ion Implantation Technology (IIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIT.2014.6940042","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved ion source stability using H2 co-gas for fluoride based dopants
Fluoride based gases are commonly used in the ion implantation. Gases such as GeF4, SiF4 use as pre-amorphization species and BF3 is for high dose p-type BF2 and 11Boron can be a productivity challenge for conventional ion implanters used for semi-conductor device applications. As device geometries continuously shrink, there is a trend to deliver higher beam currents at lower energies, with a corresponding reduction in particles and metal contamination.