利用H2共气改善氟基掺杂剂离子源稳定性

T. Hsieh, N. Colvin
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引用次数: 1

摘要

氟基气体通常用于离子注入。GeF4、SiF4等气体用作预非晶化物质,BF3用于高剂量的p型BF2和11b,硼对于用于半导体器件应用的传统离子注入剂来说是一个生产力挑战。随着器件几何形状的不断缩小,有一种趋势是在更低的能量下提供更高的光束电流,从而相应减少粒子和金属污染。
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Improved ion source stability using H2 co-gas for fluoride based dopants
Fluoride based gases are commonly used in the ion implantation. Gases such as GeF4, SiF4 use as pre-amorphization species and BF3 is for high dose p-type BF2 and 11Boron can be a productivity challenge for conventional ion implanters used for semi-conductor device applications. As device geometries continuously shrink, there is a trend to deliver higher beam currents at lower energies, with a corresponding reduction in particles and metal contamination.
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