A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini
{"title":"多晶硅Mems冲击破裂模拟","authors":"A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini","doi":"10.1109/ESIME.2006.1643984","DOIUrl":null,"url":null,"abstract":"The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"26 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Simulation of Impact Rupture in Polysilicon Mems\",\"authors\":\"A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini\",\"doi\":\"10.1109/ESIME.2006.1643984\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach\",\"PeriodicalId\":60796,\"journal\":{\"name\":\"微纳电子与智能制造\",\"volume\":\"26 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"微纳电子与智能制造\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2006.1643984\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach
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