用于高级包装的高紫外线透射玻璃载体

Jay Zhang, Indy Dutta, J. Brueckner, Katsumi Bono
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引用次数: 0

摘要

玻璃载体晶圆用于许多临时粘合和脱粘应用,如晶圆减薄和扇形晶圆级封装。对于基于光的脱粘,通常选择UV光源是出于以下一个或多个原因:限制光渗透到敏感的模区;提供均匀的光束能量分布;减少热问题;最大化整体流程吞吐量。康宁最近针对市场需求开发了高紫外线透射率玻璃载体晶圆。在本文中,我们将讨论使用这种玻璃晶圆进行308nm准分子激光脱粘以及较短波长的紫外灯脱粘的好处。
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High UV Transmission Glass Carriers for Advanced Packaging
Glass carrier wafers are used in many temporary bonding and debonding applications such as wafer thinning and fan-out wafer level packaging. For light-based debonding, a UV light source is often chosen for one or more of the following reasons: limiting light penetration into the sensitive die area; providing uniform light beam energy distribution; minimizing heat problems; maximizing overall process throughput. Corning has recently developed high UV transmission glass carrier wafers in response to market demand. In this paper, we will discuss the benefits of using such glass wafers for 308nm excimer laser debonding as well as a shorter wavelength UV lamp debonding cases.
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