利用机电屈曲法测量残余应力

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1643991

S. Abu-Salih, D. Elata

{"title":"利用机电屈曲法测量残余应力","authors":"S. Abu-Salih, D. Elata","doi":"10.1109/ESIME.2006.1643991","DOIUrl":null,"url":null,"abstract":"In this work, a new test structure and method for measuring residual stress is presented. The test structure is a single clamped-clamped beam with electrodes symmetrically positioned along both sides of the beam. The electromechanical buckling response is used to measure the residual stress. It is shown that a single test structure of the proposed design may be used to measure both compressive and tensile residual stresses in a continuous wide range","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Using ElectroMechanical Buckling for Measuring Residual Stress\",\"authors\":\"S. Abu-Salih, D. Elata\",\"doi\":\"10.1109/ESIME.2006.1643991\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a new test structure and method for measuring residual stress is presented. The test structure is a single clamped-clamped beam with electrodes symmetrically positioned along both sides of the beam. The electromechanical buckling response is used to measure the residual stress. It is shown that a single test structure of the proposed design may be used to measure both compressive and tensile residual stresses in a continuous wide range\",\"PeriodicalId\":60796,\"journal\":{\"name\":\"微纳电子与智能制造\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"微纳电子与智能制造\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2006.1643991\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643991","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文提出了一种新的残余应力测试结构和方法。测试结构是一个单夹紧-夹紧的梁，电极沿梁的两侧对称地定位。利用机电屈曲响应测量残余应力。结果表明，所设计的单一测试结构可以在连续的大范围内测量压缩和拉伸残余应力

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Using ElectroMechanical Buckling for Measuring Residual Stress

In this work, a new test structure and method for measuring residual stress is presented. The test structure is a single clamped-clamped beam with electrodes symmetrically positioned along both sides of the beam. The electromechanical buckling response is used to measure the residual stress. It is shown that a single test structure of the proposed design may be used to measure both compressive and tensile residual stresses in a continuous wide range

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

微纳电子与智能制造

自引率

0.00%

发文量

145

期刊最新文献

Front Matter: Volume 12072 Front Matter: Volume 12073 Multi-Energy Domain Modeling of Microdevices: Virtual Prototyping by Predictive Simulation A Monte Carlo Investigation of Nanocrystal Memory Reliability Difficulties on the estimation of the thermal structure function from noisy thermal impedance transients