采用高散热材料

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382129

G. Lee, J. Lin

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引用次数: 3

摘要

随着电路密度的增加，通过元件表面散热变得更加困难。因此，用于散热的材料的设计和应用以及高导热性和低CTE已成为讨论的焦点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The introduction of high heat dissipation material

Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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