会议联席主席吴安烨致欢迎辞

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382219

A. Wu

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摘要

感谢您参加IMPACT会议2009及国际3D集成电路会议。由于三维集成电路技术的发展趋势，在世界范围内得到了广泛的讨论;国家知识产权局特别与IMPACT举办了这次联合会议，在会议上介绍更多3D集成电路技术。

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Welcome message from An-Yeu Wu, conference co-chair

Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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