{"title":"63Sn37Pb焊料中添加钯对CCGA封装工艺的影响","authors":"Yingzhuo Huang, P. Lin, Yusheng Cao, Quanbin Yao","doi":"10.1109/ISAPM.2011.6105728","DOIUrl":null,"url":null,"abstract":"Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"45 1","pages":"145-148"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package\",\"authors\":\"Yingzhuo Huang, P. Lin, Yusheng Cao, Quanbin Yao\",\"doi\":\"10.1109/ISAPM.2011.6105728\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.\",\"PeriodicalId\":6440,\"journal\":{\"name\":\"2011 International Symposium on Advanced Packaging Materials (APM)\",\"volume\":\"45 1\",\"pages\":\"145-148\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Symposium on Advanced Packaging Materials (APM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.2011.6105728\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105728","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package
Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.
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