三维SiP结构热设计及模流工艺优化

Yu-Hsiang Chang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, D. Tarng, C. Hung
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摘要

随着5G时代的到来,最近各大封装和测试厂都在频繁行动。显然,随着对性能的要求越来越高,SiP是一种将包括处理器、存储器在内的多个功能芯片集成到一个封装中的功能封装。然而,热设计是目前需要解决的一个重要问题。本文主要介绍了一种基于两基板组合的3D SiP结构,该结构在单个封装中集成了4个组件,总功耗为30瓦。为了解决这种3D SiP的热管理困难,设计了一种方法来增加两块板之间的热路径。研究了通孔结构、通孔数量和元件位置变化对热工性能的影响。在两块板之间设计了热通孔,提供直接散热,连接无源元件上方的金属螺柱,提高散热性能。当通孔数从240个增加到912个时,热工性能提高了0.4%,温度分别下降了1.0%和0.6%。热阻(θJB)比较差分别为1.9%、1.5%和1.0%。通孔的改进存在局限性,增加通孔数量的效果不如预期。然而,增加热传导路径可能会对模流的空洞产生影响。利用Moldex3D对带模压下填料(MUF)的传递成型过程进行三维模流建模,优化设计和工艺参数,减少器件缺陷。有一个重要的挑战,面临着空气空洞滞留在成型区域。通常,实验涉及大量实验矩阵的设计,需要花费大量的时间来解决空隙问题。基于以上原因,模流仿真可以应用成型参数找出无SiP空隙风险的最佳解决方案,从而缩短批量生产前的开发周期。从模流仿真结果来看,增加柱塞段数,降低尾部流量,可有效改善空腔问题。
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Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure
With the advent of the 5G era, major package and testing plants have been taking frequent action recently. Obviously, with higher and higher performance requirements, SiP is a functional package integrated multiple functional chips, including processor, memory into one package. However, thermal design is an important issue to be addressed at this time. This paper mainly presents a 3D SiP structure based on the combination of two substrates, integrating 4 components in a single package, total power consumption is 30 Watt. To address thermal management difficulties of this 3D SiP, a method is designed to increase the thermal path between the two boards. The Effects of the structure, number of via, and changing location of components aspects of the thermal performance are studied. The thermal vias was designed in between the two boards provide are direct heat dissipation, connecting the metal studs above passive components to improve thermal performance. Thermal performance with 240 vias is improved by 0.4%, while the number of vias increases from 240 to 912, the temperature decreases only 1.0%, 0.6% respectively. The difference of thermal resistance (θJB) comparison is 1.9%, 1.5% and 1.0%. There are limits to the improvement of vias, the effect of increasing the number of via is not as good as expected. However, increasing the thermal conduction path may have an effect on the void of mold flow. s 3D mold flow modeling of the transfer molding process with molded underfill (MUF) using Moldex3D is applied to optimize design and process parameters that can reduce device defects. There is one important challenge that faced air voids entrapment in molding area. Generally, the experiments involve a lot of design of experiment (DOE) matrixes which spend a lot of time to solve air void issue. As above reasons, the mold flow simulation can be used to apply molding parameters to find out optimum solutions for air void risk free of SiP, which can reduce development cycle time before mass production. From the mold flow simulation results, when the number of plunger segments increases and the tail flow rate decreases, the void issues can be effectively improved.
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