第二部分概述:处理器:数字架构和系统小组委员会

T. Burd, M. Khellah, Byeong-Gyu Nam
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引用次数: 0

摘要

云到边缘应用的持续增长正在推动数字处理器的创新。本次会议的前两篇论文涉及下一代服务器级处理器。其次是节能的14nm图形处理器。下面将介绍在MCM上可配置1-4个芯片的SoC,以服务于多个市场。最后三篇论文展示了数据报传输层安全(DTLS)协议在硬件中的首次实现,一个兼容msp430的微控制器,具有双模式,可实现最低功耗和最低能耗,以及一个用于物联网应用的净零能耗(NZE)智能远程SiP。
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Session 2 overview: Processors: Digital architectures and systems subcommittee
Continued growth in cloud-to-edge applications is driving innovations in digital processors. The first two papers of this session cover next-generation server-class processors. This is followed by an energy-efficient 14nm graphics processor. An SoC configurable with 1–4 chips on an MCM to service multiple markets is described next. The last three papers demonstrate the first implementation of the datagram transport layer security (DTLS) protocol in hardware, an MSP430-compatible microcontroller with dual-mode enabling minimum-power and minimum-energy, and a net-zero-energy (NZE) smart mote SiP for IoT applications.
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