带浮动有源电感的CMOS宽带跨阻放大器的设计

Xiangyu Chen, Yasuhiro Takahashi
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引用次数: 5

摘要

本文介绍了一种采用180nm CMOS技术实现的跨阻放大器(TIA)的设计和性能。所介绍的TIA采用基于陀螺- c结构的浮动有源电感(FAI),这就是为什么它可以在占用更小的芯片面积的同时增加带宽。并对陀螺- c结构和FAI的原理图和特点进行了说明。此外,所提出的TIA还采用电容性退化、宽带匹配网络和可调节级联码(RGC)输入级相结合的方法,将跨阻放大器(TIA)设计变成具有巴特沃斯响应的五阶低通滤波器,以提高带宽和增益。TIA采用0.18 m Rohm CMOS技术和1.8 v电源实现。该跨阻放大器的跨阻增益为41dBΩ,在10 GHz的-3 dB频率下,总输入电容为0.1pF。TIA的版图尺寸为180 μm × 118 μm。
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Design of a CMOS Broadband Transimpedance Amplifier with Floating Active Inductor
This work presents the design and performance of a transimpedance amplifier (TIA) implemented in a 180nm CMOS technology. The introduced TIA uses a floating active inductor (FAI) based on gyrator-C structure, which is why it can increase the bandwidth while occupying a smaller chip area. And we have explained the schematic and characteristics of the gyrator-C structure and FAI. In addition, the proposed TIA also uses the combination of capacitive degeneration, broadband matching network, and the regulated cascode (RGC) input stage, which turns the transimpedance amplifier (TIA) design into a fifth-order low-pass filter with butterworth response, to enhance the bandwidth and the gain. The TIA is implemented in 0.18 m Rohm CMOS technology and a 1.8-V supply. The transimpedance amplifier achieves a transimpedance gain of 41dBΩ and -3 dB frequency of 10 GHz with 0.1pF total input capacitance. Layout size of the proposed TIA is 180 μm × 118 μm.
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