Qingpeng Wang, Yu De Chen, Jacky Huang, Wuping Liu, Ervin Joseph
{"title":"通过虚拟制造提高良率:利用失效仓分类、良率预测和工艺窗口优化来识别和预防工艺故障","authors":"Qingpeng Wang, Yu De Chen, Jacky Huang, Wuping Liu, Ervin Joseph","doi":"10.1109/CSTIC49141.2020.9282443","DOIUrl":null,"url":null,"abstract":"This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specification control. We identified high resistance failure as the top failure mode in both non-optimized and optimized process models.","PeriodicalId":6848,"journal":{"name":"2020 China Semiconductor Technology International Conference (CSTIC)","volume":"19 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Yield Enhancement by Virtual Fabrication: Using Failure Bin Classification, Yield Prediction and Process Window Optimization to Identify and Prevent Process Failures\",\"authors\":\"Qingpeng Wang, Yu De Chen, Jacky Huang, Wuping Liu, Ervin Joseph\",\"doi\":\"10.1109/CSTIC49141.2020.9282443\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specification control. We identified high resistance failure as the top failure mode in both non-optimized and optimized process models.\",\"PeriodicalId\":6848,\"journal\":{\"name\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"19 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC49141.2020.9282443\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC49141.2020.9282443","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Yield Enhancement by Virtual Fabrication: Using Failure Bin Classification, Yield Prediction and Process Window Optimization to Identify and Prevent Process Failures
This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specification control. We identified high resistance failure as the top failure mode in both non-optimized and optimized process models.