O. Rozen, S. T. Block, Stefon E. Shelton, D. Horsley
{"title":"通过同心通气环增加输出压力的压电微机械超声换能器","authors":"O. Rozen, S. T. Block, Stefon E. Shelton, D. Horsley","doi":"10.1109/TRANSDUCERS.2015.7181012","DOIUrl":null,"url":null,"abstract":"In a conventional piezoelectric micromachined ultrasonic transducer (PMUT), only half the acoustic output is used, because pressure emerging from the back of the PMUT is wasted. Here, we demonstrate a novel method to recycle the back-side acoustic pressure by redirecting it to the front-side through concentric venting rings. The ring diameter determines the phase-shift between the sound emerging from the front-side port and the ring, and can be adjusted to either amplify the far-field sound pressure level (SPL) or change the directivity of the output beam. Devices were fabricated in an industrial foundry process using wafer-level bonding of a MEMS PMUT wafer to a CMOS wafer using a conductive metal eutectic bond. We have designed, fabricated, and characterized nine new venting designs, and we achieved a 4.5 dB increase in SPL for a design with a 400 μm radius venting ring.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Piezoelectric micromachined ultrasonic transducer with increased output pressure via concentric venting rings\",\"authors\":\"O. Rozen, S. T. Block, Stefon E. Shelton, D. Horsley\",\"doi\":\"10.1109/TRANSDUCERS.2015.7181012\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In a conventional piezoelectric micromachined ultrasonic transducer (PMUT), only half the acoustic output is used, because pressure emerging from the back of the PMUT is wasted. Here, we demonstrate a novel method to recycle the back-side acoustic pressure by redirecting it to the front-side through concentric venting rings. The ring diameter determines the phase-shift between the sound emerging from the front-side port and the ring, and can be adjusted to either amplify the far-field sound pressure level (SPL) or change the directivity of the output beam. Devices were fabricated in an industrial foundry process using wafer-level bonding of a MEMS PMUT wafer to a CMOS wafer using a conductive metal eutectic bond. We have designed, fabricated, and characterized nine new venting designs, and we achieved a 4.5 dB increase in SPL for a design with a 400 μm radius venting ring.\",\"PeriodicalId\":6465,\"journal\":{\"name\":\"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TRANSDUCERS.2015.7181012\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2015.7181012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Piezoelectric micromachined ultrasonic transducer with increased output pressure via concentric venting rings
In a conventional piezoelectric micromachined ultrasonic transducer (PMUT), only half the acoustic output is used, because pressure emerging from the back of the PMUT is wasted. Here, we demonstrate a novel method to recycle the back-side acoustic pressure by redirecting it to the front-side through concentric venting rings. The ring diameter determines the phase-shift between the sound emerging from the front-side port and the ring, and can be adjusted to either amplify the far-field sound pressure level (SPL) or change the directivity of the output beam. Devices were fabricated in an industrial foundry process using wafer-level bonding of a MEMS PMUT wafer to a CMOS wafer using a conductive metal eutectic bond. We have designed, fabricated, and characterized nine new venting designs, and we achieved a 4.5 dB increase in SPL for a design with a 400 μm radius venting ring.