氦基等离子体的掺杂机理

G. Fuse, M. Kuriyama, M. Sugitani, M. Tanaka
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引用次数: 0

摘要

研究了氦基等离子体掺杂(He-PD)的机理。超低能注入后的氦等离子体辐照实验结果首次揭示了掺杂原子被大量氦原子撞击的机理。硼原子和磷原子被敲入几乎相同的深度。砷离子也进行了评价,并观察到比硼和磷更深的深度掺杂。此外,He-PD并不一定表现出比传统离子注入更陡峭的陡度,但它仅限于低功率条件下。氦辐照的移动距离与原子质量无关,而与原子半径线性相关。像砷这样的大原子比像硼和磷这样的小原子移动得快。
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Doping mechanism of helium-based plasma
The mechanism of helium-based plasma doping (He-PD) was investigated. It is found out for the first time that the mechanism is that dopant atoms are knocked-on by a huge number of helium atoms, born out by the results of experiments of helium plasma irradiation following the ultra-low energy implantations. Boron and phosphorous atoms are knocked-on to the almost same depth. Arsenic ions are also evaluated and deeper depth doping than boron and phosphorous is observed. Additionally, it is not necessarily the case that the profile by the He-PD shows steeper abruptness than conventional ion implantation but it is limited to the low power condition. The moving distance by helium irradiation does not depend on atom mass but it correlates linearly to the atom radius. Large atoms such as arsenic moves more than smaller atoms like boron and phosphorous.
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