Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader

In this paper, we evaluate the board-level thermal performance of QFP with an unattached drop-in heat spreader numerically and experimentally. The die is given a power dissipation and induced thermomechanical deformations and the gap distribution on the unattached interface are calculated through the three-dimensional thermal-mechanical coupling analysis incorporated with the contact methodology. The measured junction to ambient thermal resistance is used to validate the numerical results, which involve different interfacial thermal transfer conditions