Shih-Tang Chen, Hua-Chiang Chen, Kun-Cheng Huang, Fu-Ken Liu, C. Leu
{"title":"自旋镀膜法制备Si/SiO2/Au纳米颗粒/HfO2 MOS电容器结构","authors":"Shih-Tang Chen, Hua-Chiang Chen, Kun-Cheng Huang, Fu-Ken Liu, C. Leu","doi":"10.1109/INEC.2010.5424590","DOIUrl":null,"url":null,"abstract":"In this work, a Metal-Oxide-Semiconductor (MOS) capacitor (Si/SiO2/Au nanoparticles/HfO2) has been fabricated. Gold (Au) nanoparticles with particle size of about 3.3nm were synthesized by chemical reduction method. Then the self-assembled gold nanoparticles were attached to 3-aminopropyltrimethoxysilane (APTMS) modified silicon oxide substrates by the spin coating method. With the spin coating method, the gold nanoparticles can be fabricated onto 5.0 nm thermally grown silicon oxide with highly packing density of 1×1012cm−2 in a short processing time. Finally, the sol-gel derived HfO2 layer was spin coated to construct a Si/SiO2/Au nanoparticles/HfO2 structure. The MOS structure embedded with Au nanoparticles showed well defined counterclockwise C-V hysteresis curves which indicating a good memory effect. The flat-band voltage shift was about 2.7 V at a swapping voltage between ±5V. Furthermore, the MOS structure embedded with Au nanoparticles behaved a desirable retention characteristic up to 104s. We have succeeded to fabricate the Metal-Oxide-Semiconductor capacitor structure (Si/SiO2/Au nanoparticles/HfO2) by a spin coating method. The spin coating method has many advantages like short fabrication time, high uniformity, and better reproducibility when compared with the traditional immersion method. Therefore, the spin coating method has the potential to be applied to nanofabrication processes in mass production.","PeriodicalId":6390,"journal":{"name":"2010 3rd International Nanoelectronics Conference (INEC)","volume":"3 1","pages":"710-711"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of Si/SiO2/Au nanoparticles/HfO2 MOS capacitor structure by spin coating method\",\"authors\":\"Shih-Tang Chen, Hua-Chiang Chen, Kun-Cheng Huang, Fu-Ken Liu, C. Leu\",\"doi\":\"10.1109/INEC.2010.5424590\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a Metal-Oxide-Semiconductor (MOS) capacitor (Si/SiO2/Au nanoparticles/HfO2) has been fabricated. Gold (Au) nanoparticles with particle size of about 3.3nm were synthesized by chemical reduction method. Then the self-assembled gold nanoparticles were attached to 3-aminopropyltrimethoxysilane (APTMS) modified silicon oxide substrates by the spin coating method. With the spin coating method, the gold nanoparticles can be fabricated onto 5.0 nm thermally grown silicon oxide with highly packing density of 1×1012cm−2 in a short processing time. Finally, the sol-gel derived HfO2 layer was spin coated to construct a Si/SiO2/Au nanoparticles/HfO2 structure. The MOS structure embedded with Au nanoparticles showed well defined counterclockwise C-V hysteresis curves which indicating a good memory effect. The flat-band voltage shift was about 2.7 V at a swapping voltage between ±5V. Furthermore, the MOS structure embedded with Au nanoparticles behaved a desirable retention characteristic up to 104s. We have succeeded to fabricate the Metal-Oxide-Semiconductor capacitor structure (Si/SiO2/Au nanoparticles/HfO2) by a spin coating method. The spin coating method has many advantages like short fabrication time, high uniformity, and better reproducibility when compared with the traditional immersion method. Therefore, the spin coating method has the potential to be applied to nanofabrication processes in mass production.\",\"PeriodicalId\":6390,\"journal\":{\"name\":\"2010 3rd International Nanoelectronics Conference (INEC)\",\"volume\":\"3 1\",\"pages\":\"710-711\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-03-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 3rd International Nanoelectronics Conference (INEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INEC.2010.5424590\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 3rd International Nanoelectronics Conference (INEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INEC.2010.5424590","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication of Si/SiO2/Au nanoparticles/HfO2 MOS capacitor structure by spin coating method
In this work, a Metal-Oxide-Semiconductor (MOS) capacitor (Si/SiO2/Au nanoparticles/HfO2) has been fabricated. Gold (Au) nanoparticles with particle size of about 3.3nm were synthesized by chemical reduction method. Then the self-assembled gold nanoparticles were attached to 3-aminopropyltrimethoxysilane (APTMS) modified silicon oxide substrates by the spin coating method. With the spin coating method, the gold nanoparticles can be fabricated onto 5.0 nm thermally grown silicon oxide with highly packing density of 1×1012cm−2 in a short processing time. Finally, the sol-gel derived HfO2 layer was spin coated to construct a Si/SiO2/Au nanoparticles/HfO2 structure. The MOS structure embedded with Au nanoparticles showed well defined counterclockwise C-V hysteresis curves which indicating a good memory effect. The flat-band voltage shift was about 2.7 V at a swapping voltage between ±5V. Furthermore, the MOS structure embedded with Au nanoparticles behaved a desirable retention characteristic up to 104s. We have succeeded to fabricate the Metal-Oxide-Semiconductor capacitor structure (Si/SiO2/Au nanoparticles/HfO2) by a spin coating method. The spin coating method has many advantages like short fabrication time, high uniformity, and better reproducibility when compared with the traditional immersion method. Therefore, the spin coating method has the potential to be applied to nanofabrication processes in mass production.