K. Kippes, P. Dunaway, J. Biggs, Ryan Parrot, David Young, Charlie Hill
{"title":"通过媒体包装改善环境","authors":"K. Kippes, P. Dunaway, J. Biggs, Ryan Parrot, David Young, Charlie Hill","doi":"10.1109/ASMC49169.2020.9185194","DOIUrl":null,"url":null,"abstract":"This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel’s Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"19 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Environmental improvements through media packaging\",\"authors\":\"K. Kippes, P. Dunaway, J. Biggs, Ryan Parrot, David Young, Charlie Hill\",\"doi\":\"10.1109/ASMC49169.2020.9185194\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel’s Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.\",\"PeriodicalId\":6771,\"journal\":{\"name\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"19 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC49169.2020.9185194\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Environmental improvements through media packaging
This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel’s Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.
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