Clarence Chan, Shunya Namiki, J. Hite, M. Mastro, S. Qadri, Xiuling Li
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引用次数: 9
摘要
金属辅助化学刻蚀是一种无等离子体开路各向异性刻蚀方法,可在各种半导体中产生高纵横比结构。在这里,我们首次展示了有序微柱阵列的形成同外延GaN,使用光增强MacEtch与图案铂薄膜作为催化剂。研究了GaN的蚀刻速率和形貌与蚀刻化学、生长方式和掺杂条件的关系,并分析了其蚀刻机理。随着氮化镓中硅掺杂水平的提高,其蚀刻速率和表面光滑度也随之提高,接近于反应离子蚀刻和光电化学蚀刻所达到的水平。空间分辨光致发光在近带边缘发射没有退化,也没有新的缺陷峰产生,这是由于高能量的无离子特性所导致的。这种方法也可以通过调整蚀刻化学和照明波长来潜在地应用于InGaN和AlGaN,从而实现基于3D iii -氮化物的电子和光电子器件(如μ led和finfet)的简单和可扩展处理。
Homoepitaxial GaN micropillar array by plasma-free photo-enhanced metal-assisted chemical etching
Metal-assisted chemical etching is a plasma-free open-circuit anisotropic etching method that produces high aspect ratio structures in various semiconductors. Here, for the first time, we demonstrate the formation of ordered micropillar arrays of homoepitaxial GaN, using photo-enhanced MacEtch with patterned platinum films as the catalyst. The GaN etching rate and morphology as a function of etching chemistry, growth method, and doping conditions are investigated, and the etch mechanism is analyzed. Etch rates and surface smoothness are found to increase with the Si-doping level in GaN, approaching those achieved by reactive ion etching and photoelectrochemical etching. Spatially resolved photoluminescence shows no degradation in near band edge emission and no newly generated defect peaks, as expected due to the high energy ion free nature. This approach can also potentially be applied to InGaN and AlGaN by tuning the etch chemistry and illumination wavelength, enabling a facile and scalable processing of 3D III-nitride based electronic and optoelectronic devices such as μLEDs and finFETs.