常压等离子体射流原位沉积Ar/H2等离子体处理In-Ga-Zn-O tft的研究

Kow-Ming Chang, Bo-Wen Huang, Chien-Hung Wu, Hsin-Ying Chen, Y. Zheng, Ming-Chuan Lee, Yu-Xin Zhang, Chuang-Ju Lin, Yu-Hsuan Cheng, Shui-Jinn Wang, Jui-Mei Hsu, Yuli Lin
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引用次数: 1

摘要

采用常压等离子体增强化学气相沉积技术(AP-PECVD)制备了非晶铟镓锌氧化物薄膜晶体管(a-IGZO TFTs)。本文首次采用常压等离子体射流(APPJ)原位Ar/H2等离子体后沉积的方法对AP-PECVD技术制备的a-IGZO tft进行了处理。与未经等离子体处理的样品相比,经过原位Ar/H2等离子体处理的样品在IGZO活性层上具有更高的迁移率(20.12 cm2/V·S), VT为1.11 V,亚阈值摆幅(93 mV/decade)更低,离子/离合(5.34×107)更高。用AP-PECVD技术制备的IGZO tft也表现出高透明的特性。
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The investigation for In-Ga-Zn-O TFTs with post deposition of in-situ Ar/H2 plasma treatment by atmospheric pressure plasma Jet
Atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) was applied for the fabrication of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs). In this work, a-IGZO TFTs fabricated by AP-PECVD technique were firstly treated by post deposition of in-situ Ar/H2 plasma with atmospheric pressure plasma Jet (APPJ). Compared to without plasma treatment, samples with the post in-situ Ar/H2 plasma treatment on IGZO active layer exhibited higher mobility of 20.12 cm2/V·S, VT of 1.11 V, lower subthreshold swing of 93 mV/decade, higher Ion/Ioff of 5.34×107. The excellent IGZO TFTs fabricated by AP-PECVD technique also show highly transparent characteristics.
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