热扩散技术的发展现状

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382184

Shung-Wen Kang, Meng-chang Tsai, M. Weng, Chao-Hsiang Hsu

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引用次数: 2

摘要

热扩散是一种减少电子冷却和其他高热流密度应用中的热点的技术，其特点是高传热、均匀散热。蒸汽室是一种依赖于两相热管技术的热传导技术。本文介绍了蒸汽室在电子冷却、大功率led、多热源、通信器件、生物技术等方面的应用，综述了目前热扩散技术的发展，总结了热模块内蒸汽室的影响、未来的应用和建议。提出了几种多热源冷却模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of Thermal spreading technology nowadays

Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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