生长温度和厚度对BiFeO3外延薄膜晶体和微畴结构的影响

K. Ujimoto, T. Yoshimura, N. Fujimura
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引用次数: 0

摘要

研究了在400 ~ 700℃温度下沉积的0.2 ~ 2.0 μm厚BiFeO3外延膜的晶体结构和微观结构,如表面形貌和铁电畴结构。在500℃沉积的薄膜中,生长出了四角形的BiFeO3,随着薄膜厚度的增加,晶格应变发生了剧烈的弛豫。另一方面,在650℃下沉积的薄膜生长出具有四方畸变的菱形BiFeO3,晶粒生长导致晶格应变的松弛。500℃沉积的薄膜晶粒为单畴结构,650℃沉积的薄膜晶粒为多畴结构。晶粒内部存在的畴壁对压电响应有贡献。
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Growth temperature and thickness dependences of crystal and micro domain structures of BiFeO3 epitaxial films
Crystal structure and microstructure such as surface morphology and ferroelectric domain structure of 0.2- to 2.0-μm-thick BiFeO3 epitaxial films deposited between 400 and 700°C were evaluated. For the films deposited at 500°C, tetragonal BiFeO3 was grown The relaxation of the lattice strain drastically occurred by increasing the film thickness. On the other hand, rhombohedral BiFeO3 with tetragonal distortion was grown and the relaxation of the lattice strain occurred by the grain growth for the films deposited at 650°C. The grains consist of single domain for the films deposited at 500°C, while those of films deposited at 650°C consist of multi domains. It is suggested that the domain walls existing inside the grains contributes the piezoelectric response.
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