紧凑的高q半球形谐振器,用于3d打印带通滤波器应用

Jin Li, Cheng Guo, Lijian Mao, Jun Xu
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引用次数: 19

摘要

首次提出了一种新型半球形谐振器,具有高空载质量因子(Qu)和紧凑的几何结构,可用于3d打印带通滤波器(BPF)应用。在相同的主模谐振频率下,半球形谐振腔的体积只有球形谐振腔的一半,但没有失去其固有的高曲度特性。阐述了半球形谐振腔的电磁场分析,并在X和Ka波段设计了基于半球形谐振腔的二阶bpf。ka波段二阶BPF由耐高温陶瓷填充树脂制成,采用快速低成本的基于立体光刻的3d打印技术进行验证。该滤波器的表面金属化是通过采用化学镀铜/镀银来实现的,这有助于提高导电层厚度和均匀性的制造精度。rf测量结果表明,该滤波器在31.95 ~ 32.13 GHz频段的插入损耗为0.56 ~ 0.7 dB,通带回波损耗小于17 dB,频移较小,仅为0.04%。
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Compact high-Q hemispherical resonators for 3-D printed bandpass filter applications
A new class of hemispherical resonators featuring a high unloaded quality factor (Qu) and a compact geometrical configuration is proposed for the first time for 3-D printed bandpass filter (BPF) applications. The hemispherical resonator exhibits a volume only half that of a spherical one at a same dominant-mode resonant frequency, without losing its intrinsic characteristic of a high Qu. Electromagnetic field analysis of the hemi-spherical resonator is expounded, and second-order BPFs based on such resonators are designed at X and Ka bands. The Ka-band second-order BPF is manufactured with a high-temperature-resistant ceramic-filled resin using a fast and low-cost stereo-lithography-based 3-D printing technique for validation purpose. The filter's surface metallization is achieved by employing electroless copper/silver plating, which contributes to an improved fabrication accuracy in thickness and uniformity of the conductive layer. The RF-measured results demonstrate the Ka-band filter an insertion loss of 0.56–0.7 dB at 31.95–32.13 GHz, a passband return loss of better than 17 dB, and a small frequency shift of 0.04%.
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