Xiaofei Lv, Libing Zheng, Xiangdong Kong, Pengyun Jin, Han Li
{"title":"DBC空穴与温度分布关系的研究","authors":"Xiaofei Lv, Libing Zheng, Xiangdong Kong, Pengyun Jin, Han Li","doi":"10.1109/ISAPM.2011.6105692","DOIUrl":null,"url":null,"abstract":"DBC (Direct bonding Copper) is the most common substrate of IGBT power module in recent years. The existence of voids between the copper and the ceramic is the main process defect. The temperature distribution is multiple because of the differences in the ratio and location of the voids. In this paper, the integration of the test and numerical simulation is used to research the temperature distribution of DBC with different ratios of voids and loads. The results show that the location of the voids between the copper and the ceramic influence the temperature distribution of DBC clearly.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The research of relationship between the void of DBC and the temperature distribution\",\"authors\":\"Xiaofei Lv, Libing Zheng, Xiangdong Kong, Pengyun Jin, Han Li\",\"doi\":\"10.1109/ISAPM.2011.6105692\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"DBC (Direct bonding Copper) is the most common substrate of IGBT power module in recent years. The existence of voids between the copper and the ceramic is the main process defect. The temperature distribution is multiple because of the differences in the ratio and location of the voids. In this paper, the integration of the test and numerical simulation is used to research the temperature distribution of DBC with different ratios of voids and loads. The results show that the location of the voids between the copper and the ceramic influence the temperature distribution of DBC clearly.\",\"PeriodicalId\":6440,\"journal\":{\"name\":\"2011 International Symposium on Advanced Packaging Materials (APM)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Symposium on Advanced Packaging Materials (APM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.2011.6105692\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105692","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The research of relationship between the void of DBC and the temperature distribution
DBC (Direct bonding Copper) is the most common substrate of IGBT power module in recent years. The existence of voids between the copper and the ceramic is the main process defect. The temperature distribution is multiple because of the differences in the ratio and location of the voids. In this paper, the integration of the test and numerical simulation is used to research the temperature distribution of DBC with different ratios of voids and loads. The results show that the location of the voids between the copper and the ceramic influence the temperature distribution of DBC clearly.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
