Analysis of Systematic Weak Point Structures using Design Based Automatic Defect Classification and Defect Review SEM Platform

As the complexity of both design and processing increase for advanced FinFET technology, defect metrology will continue to provide the best strategies for Defect Review Scanning Electron Microscopy (DR-SEM) and Automatic Defect Classification (ADC). The precise defect location navigation, and the accuracy of random and systematic defect classification can be improved by introducing Computer-Aided Design (CAD) into DR-SEM and ADC processes. The Design Based ADC (DBA) not only differentiates systematic and random defect on CAD for yield control but also determines the precise defect locations for weak point analysis. We will present a method for the implementation of weak point CAD for DR-SEM review and ADC through a case study of a BEOL CMP layer of an advanced FinFET process demonstrating its benefit to defect analysis and control.