硼掺入改善硅带边缘发射

N. E. A. Razak, D. Berhanuddin, C. Dee, M. Madhuku, B. Majlis
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引用次数: 0

摘要

我们报告了当晶格结构中有意引入缺陷时,硅带边发射的改善。由于硅的间接带隙性质,它是一个很差的发光体。本文的目的是通过注入硼来增加硅的发光强度,从而导致晶格结构之间形成位错环。在此之前,硅样品被注入高浓度的碳。采用光致发光(PL)测量方法,在近红外区域观察了硅的发光情况。温度在10K ~ 100K范围内变化,研究温度对峰值发光强度的影响。在~1112 nm和1170 nm处可以看到两个主要的发光峰。这两个峰在掺入硼的样品中显示出明显更高的强度。
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Improvement in silicon band edge emission with incorporation of boron
We report the improvement in silicon band-edge emission when defects are deliberately introduced in the lattice structures. Silicon is a poor light-emitter due to its indirect bandgap nature. This paper aims to increase the intensity of the light emission from silicon by implantation of boron which will lead to the formation of dislocation loops between the lattice structures. Prior to that, the silicon samples were implanted with high concentration of carbon. Photoluminescence (PL) measurements were carried out to observe the emission in silicon at near infrared region. The temperatures were varied from 10K to 100K to study the effect of temperature towards the peak luminescence intensity. By observing the PL spectra, there are two main peaks that can be seen at ~1112 nm and 1170 nm. Both peaks show significantly higher intensities in the samples incorporated with boron.
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