{"title":"聚l形图引起的深度断电泄漏研究","authors":"Chong Huang, M. Zhang, Fangce Sun, Steam Cao, Guanghua Yang, Susanna Zheng","doi":"10.1109/CSTIC49141.2020.9282454","DOIUrl":null,"url":null,"abstract":"Deep power down leakage is a very key requirement for IC chip, especially for the MCU chips with battery power supply. In this paper, we studied the deep power down mode chip leakage caused pocket shadowing effect due to poly L-shape layout. And we tried to optimize the layout and process to reduce the leakage.","PeriodicalId":6848,"journal":{"name":"2020 China Semiconductor Technology International Conference (CSTIC)","volume":"61 11","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Deep Power Down Leakage Study Caused by Poly L-sbape Pattern\",\"authors\":\"Chong Huang, M. Zhang, Fangce Sun, Steam Cao, Guanghua Yang, Susanna Zheng\",\"doi\":\"10.1109/CSTIC49141.2020.9282454\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Deep power down leakage is a very key requirement for IC chip, especially for the MCU chips with battery power supply. In this paper, we studied the deep power down mode chip leakage caused pocket shadowing effect due to poly L-shape layout. And we tried to optimize the layout and process to reduce the leakage.\",\"PeriodicalId\":6848,\"journal\":{\"name\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"61 11\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC49141.2020.9282454\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC49141.2020.9282454","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Deep Power Down Leakage Study Caused by Poly L-sbape Pattern
Deep power down leakage is a very key requirement for IC chip, especially for the MCU chips with battery power supply. In this paper, we studied the deep power down mode chip leakage caused pocket shadowing effect due to poly L-shape layout. And we tried to optimize the layout and process to reduce the leakage.