2009 IEEE International Interconnect Technology Conference

Upstream electromigration study on multiple via structures in copper interconnect

Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090347 M. Lin, N. Jou, James W. Liang, A. Juan, K. Su

Metrology of 3D IC with X-ray Microscopy and nano-scale X-ray CT

Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090362 Steve Wang, J. Gelb, S. H. Lau, W. Yun

A new physical model and experimental measurements of copper interconnect resistivity considering size effects and line-edge roughness (LER)

Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090396 G. Lopez, J. Davis, J. Meindl