Prevention of aluminum pad corrosion by UV/ozone cleaning

Seung-Ho Ahn, T. Cho, Yoon-Soo Kim, S. Oh
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引用次数: 4

Abstract

One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated.
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紫外线/臭氧清洗防止铝垫腐蚀
防止能促进铝腐蚀的水分集中的方法之一是去除铝粘接垫周围的空间。换句话说,集成电路芯片和成型化合物之间没有分层的完美粘附将不允许电解质形成和铝垫腐蚀。紫外/臭氧清洗芯片被认为能够加强芯片成型复合材料的附着力。本文研究了UV/臭氧清洗对铝垫腐蚀的预防效果,以及分层与腐蚀的关系。
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