Fast method to identify the root cause for ILD Vbd fail

Z. Gan, Y. Wu, K. Zheng, R. Guo, C. Liao
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引用次数: 1

Abstract

At the process development stage, the non-uniformity of the BEOL dielectric breakdown voltage (Vbd) in a wafer mapping is always observed. Such non-uniformity may be induced either by ¿interface-mode¿ or by ¿CD-mode¿. This paper provides a fast method to identify the root cause for ILD Vbd fail through analyzing the current-voltage (I-V) curves from the V-ramp test.
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快速确定ILD Vbd失败根本原因的方法
在工艺开发阶段,通常会观察到晶圆映射中BEOL介质击穿电压(Vbd)的不均匀性。这种不均匀性可以由“界面模式”或“cd模式”引起。本文通过分析v -斜坡试验的电流-电压(I-V)曲线,提供了一种快速识别ILD Vbd故障根本原因的方法。
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