Multiband RF-interconnect for CMP inter-core communications

Abstract

In this paper, we propose a novel on-chip global interconnect that would meet stringent challenges of core-to-core communications in data rate (up to 100 Gbps /link), latency and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitations of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are addressed as well.