{"title":"Micropackaging using thin films as mechanical components","authors":"P. Boyle, D. Moore, R. Syms","doi":"10.1109/ECTC.2002.1008191","DOIUrl":null,"url":null,"abstract":"The development and testing of simulation software based on variational principles to examine the behavior of structures undergoing large scale elastic deflections is described. The programmes are used in the design of micro mechanical beams for packaging applications, specifically in the domain of passive alignment of optical components. The micromachining/etching fabrication process is described for 5 /spl mu/m thick silicon carbide beams which are then tested by bending them.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":"276 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008191","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The development and testing of simulation software based on variational principles to examine the behavior of structures undergoing large scale elastic deflections is described. The programmes are used in the design of micro mechanical beams for packaging applications, specifically in the domain of passive alignment of optical components. The micromachining/etching fabrication process is described for 5 /spl mu/m thick silicon carbide beams which are then tested by bending them.
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