{"title":"Electric field effects in the production of ICA joints","authors":"M. Heuschkel, J. Morris","doi":"10.1109/ADHES.2000.860602","DOIUrl":null,"url":null,"abstract":"Concern over the use of toxic lead in electronic devices is driving research into lead free solder alloys and isotropic electrically conductive adhesives (ICAs). To replace the common solders with ICAs, it is both essential to know the behavior of the material during assembly process, and useful to be able to exert any form of control which will yield improved properties. The paper describes the possible influence of an electric field applied to the ICA during curing.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Concern over the use of toxic lead in electronic devices is driving research into lead free solder alloys and isotropic electrically conductive adhesives (ICAs). To replace the common solders with ICAs, it is both essential to know the behavior of the material during assembly process, and useful to be able to exert any form of control which will yield improved properties. The paper describes the possible influence of an electric field applied to the ICA during curing.
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