A novel IMB technology for integrating active and passive components

Abstract

In this study a novel integrated module board (IMB) technology which is used for integrating both active and passive components into ultra-high density printed wiring boards is presented. This non-vacuum and solderless technology is based on a photodefinable epoxy and fully additive electroless plating process. Conductive metals such as copper and nickel are chemically deposited onto photodefined wiring tracks and I/O pads of embedded active components. The IMB technology enables short conductor line lengths, small line pitches (<50 /spl mu/m) and very high packaging density. In this manner functional modules with good electrical performance and high reliability can be achieved. Passive components such as resistors, inductors and capacitors are fabricated into the substrate during the multilayer printed wiring board fabrication process. The electrical measurements of passive components are also presented and briefly discussed.