4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860609
R. Kisiel
The main goal of this paper is to establish how conductive adhesive composition will influence the electrical and mechanical properties of joints between SMDs and PCBs. Eight conductive adhesive compositions were investigated. The design of experiments methodology based on Taguchi orthogonal array was applied to compose the best adhesive properties for SMT. Two types of polymer matrix were applied. Two controllable factors for defining the compositions were used: type of filler material and level of volume contents of filler in adhesive. The filler materials and conductive adhesive compositions were prepared by AMEPOX Microelectronics, Poland. The individual adhesive joint resistance of 1206 jumper and adhesion of 1206 jumper to PCB were used as the measure of adhesive joint quality. It was found that the biggest influence on mechanical and electrical properties are the type of isolating resin and the type of filler material. For such compound adhesives the average individual joint resistance changed from 30 to 173 mn and average shearing force for 1206 component from 3 to 40 N.
{"title":"The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs","authors":"R. Kisiel","doi":"10.1109/ADHES.2000.860609","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860609","url":null,"abstract":"The main goal of this paper is to establish how conductive adhesive composition will influence the electrical and mechanical properties of joints between SMDs and PCBs. Eight conductive adhesive compositions were investigated. The design of experiments methodology based on Taguchi orthogonal array was applied to compose the best adhesive properties for SMT. Two types of polymer matrix were applied. Two controllable factors for defining the compositions were used: type of filler material and level of volume contents of filler in adhesive. The filler materials and conductive adhesive compositions were prepared by AMEPOX Microelectronics, Poland. The individual adhesive joint resistance of 1206 jumper and adhesion of 1206 jumper to PCB were used as the measure of adhesive joint quality. It was found that the biggest influence on mechanical and electrical properties are the type of isolating resin and the type of filler material. For such compound adhesives the average individual joint resistance changed from 30 to 173 mn and average shearing force for 1206 component from 3 to 40 N.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115701799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860593
M. Lantzsch
There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component.
{"title":"Epoxy adhesives with soldering properties","authors":"M. Lantzsch","doi":"10.1109/ADHES.2000.860593","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860593","url":null,"abstract":"There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"191 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116780124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860592
P. Palm, K. Puhakka, J. Maattanen, T. Heimonen, A. Tuominen
Applicability of no-flow fluxing encapsulants and flip chip technology in volume production was studied. Adhesion of the underfill materials to different solder resists was measured with single lap shear test and the results compared with traditional underfills. No-flow underfiller was dispensed with standard in line dispenser. SnPb-bumped flip chip test structures were pick and placed on FR4 substrates by using standard volume production line. The bump pitch of the test chips was 250 /spl mu/m. Sample boards were also precured in standard production oven and postcured in baking oven. No-flow underfillers showed exceptionally good adhesion to used solder resists. With the no-flow underfillers flip chip proved to be transparent to the current SMA process, however the process window for dispensing and reflowing is relatively narrow.
{"title":"Applicability of no-flow fluxing encapsulants and flip chip technology in volume production","authors":"P. Palm, K. Puhakka, J. Maattanen, T. Heimonen, A. Tuominen","doi":"10.1109/ADHES.2000.860592","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860592","url":null,"abstract":"Applicability of no-flow fluxing encapsulants and flip chip technology in volume production was studied. Adhesion of the underfill materials to different solder resists was measured with single lap shear test and the results compared with traditional underfills. No-flow underfiller was dispensed with standard in line dispenser. SnPb-bumped flip chip test structures were pick and placed on FR4 substrates by using standard volume production line. The bump pitch of the test chips was 250 /spl mu/m. Sample boards were also precured in standard production oven and postcured in baking oven. No-flow underfillers showed exceptionally good adhesion to used solder resists. With the no-flow underfillers flip chip proved to be transparent to the current SMA process, however the process window for dispensing and reflowing is relatively narrow.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125516294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860586
Li Li, T. Fang
Miniaturization and high performance demand more and more flip chip and chip scale packages for consumer products. New packages require increased functionality with a reduction in overall size and weight. The traditional flip chip approaches using solder bumps pose an unacceptably high cost for low end consumer products. Package technologies for integrated circuits with low to moderate I/O counts (below 150) are critical. A low cost and low profile flip chip on flex CSP package uses anisotropic conductive adhesive film (ACF). This package has the flexibility to use the existing wire bonding pad configuration without adding prohibitive redistribution and wafer solder bumping costs, and also eliminates the need for under-chip encapsulation. Material research and evaluations were conducted to optimize the adhesive material for flip chip on flex applications. Anisotropic conductive adhesive film bonding processes were developed through design of experiments. Critical bonding equipment parameters and process conditions were identified. ACF bonding duality was characterized to adjust the bonding equipment co-planarity. A double layer epoxy film with the second layer loaded with Au plated polymer spheres was identified to be the best ACF material. Contact resistances of the ACF joints were monitored though multiple reflow and thermal-mechanical shock cycles. Various volume production approaches were also explored.
{"title":"Anisotropic conductive adhesive films for flip chip on flex packages","authors":"Li Li, T. Fang","doi":"10.1109/ADHES.2000.860586","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860586","url":null,"abstract":"Miniaturization and high performance demand more and more flip chip and chip scale packages for consumer products. New packages require increased functionality with a reduction in overall size and weight. The traditional flip chip approaches using solder bumps pose an unacceptably high cost for low end consumer products. Package technologies for integrated circuits with low to moderate I/O counts (below 150) are critical. A low cost and low profile flip chip on flex CSP package uses anisotropic conductive adhesive film (ACF). This package has the flexibility to use the existing wire bonding pad configuration without adding prohibitive redistribution and wafer solder bumping costs, and also eliminates the need for under-chip encapsulation. Material research and evaluations were conducted to optimize the adhesive material for flip chip on flex applications. Anisotropic conductive adhesive film bonding processes were developed through design of experiments. Critical bonding equipment parameters and process conditions were identified. ACF bonding duality was characterized to adjust the bonding equipment co-planarity. A double layer epoxy film with the second layer loaded with Au plated polymer spheres was identified to be the best ACF material. Contact resistances of the ACF joints were monitored though multiple reflow and thermal-mechanical shock cycles. Various volume production approaches were also explored.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129419387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860598
K. Curran, M. Holloway, A. Lennox
Summary form only given, as follows. The use of anisotropically conductive film as an interconnect method for direct flip chip attach and for flex to glass offers many benefits to both product designers and SMT assembly engineers. However, as the technology in is relatively new, data on both processing conditions and field performance is limited. This paper is divided into two sections. Firstly, the processing parameters that influence the quality of joints obtained with ACF and how these processes can be optimised. Particular emphasis is given to the effect of processing conditions to joint reliability and electrical performance. The effect of storage conditions and the exposure of unused film will be examined. This data was gathered during the evaluation of an ordered anisotropic film material for use with flip chips. The second part of the paper concentrates on the performance of the material in a variety of environmental and stress tests used to simulate field conditions, including thermal shock, and high temperature and humidity environments. Particular emphasis will be given to the evaluation of the drop impact resistance of the adhesive joints, with background information on the measurement techniques used to simulate the impacts experienced by portable electronic devices such as CD players and mobile phones. This paper should provide a useful introduction to both product designers and process engineers interested in the use of anisotropic adhesives as an interconnect solution in portable electronic products.
{"title":"The evaluation of anisotropically conductive film for use in portable electronic products","authors":"K. Curran, M. Holloway, A. Lennox","doi":"10.1109/ADHES.2000.860598","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860598","url":null,"abstract":"Summary form only given, as follows. The use of anisotropically conductive film as an interconnect method for direct flip chip attach and for flex to glass offers many benefits to both product designers and SMT assembly engineers. However, as the technology in is relatively new, data on both processing conditions and field performance is limited. This paper is divided into two sections. Firstly, the processing parameters that influence the quality of joints obtained with ACF and how these processes can be optimised. Particular emphasis is given to the effect of processing conditions to joint reliability and electrical performance. The effect of storage conditions and the exposure of unused film will be examined. This data was gathered during the evaluation of an ordered anisotropic film material for use with flip chips. The second part of the paper concentrates on the performance of the material in a variety of environmental and stress tests used to simulate field conditions, including thermal shock, and high temperature and humidity environments. Particular emphasis will be given to the evaluation of the drop impact resistance of the adhesive joints, with background information on the measurement techniques used to simulate the impacts experienced by portable electronic devices such as CD players and mobile phones. This paper should provide a useful introduction to both product designers and process engineers interested in the use of anisotropic adhesives as an interconnect solution in portable electronic products.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129862427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860576
S. Luo, T. Yamashita, C. Wong
The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine
{"title":"Adhesion performance and thermo-mechanical property of epoxy-based underfill","authors":"S. Luo, T. Yamashita, C. Wong","doi":"10.1109/ADHES.2000.860576","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860576","url":null,"abstract":"The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine<imidazole derivatives<cobalt acetylacetonate. The bulk properties of the systems were studied through a thermo-mechanical analyzer (TMA). Epoxy resins cured with different catalysts showed different glass transition temperatures (T/sub g/) and coefficients of thermal expansion (CTE). Among them, the CAA catalyzed systems showed the highest T/sub g/ and low CTE. Due to the cycloaliphatic structure of the ERL4221 resin, the cured ERL4221 systems showed the highest T/sub g/ compared to the other systems with the same catalysts. EPON8281 systems generally had lower moisture absorption than the other epoxy systems. The surface tension of the underfills was measured. The adhesion strength was evaluated by a die shear test with SiO/sub 2/ and Si/sub 3/N/sub 4/ (SiN) passivated silicon dies as substrates.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129109626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860597
O. Rusanen
Flip chip bonding with isotropically conducting adhesives is gaining in popularity since it can simplify and reduce the cost of the interconnecting process. To effectively estimate the reliability of ICA flip chip joints, one needs to model the viscoelastic behaviour of the adhesives. Creep is an important property because it enables stress relaxation through non-recoverable strain. Ignoring ICA creep in FE-simulations will result in overestimation of stress and underestimation of strain in a joint. This paper proposes that ICAs can be modelled as a Maxwell element to calculate creep compliance rates. The creep compliance rates are needed for simulating stress-strain hysteresis curves during a thermal cycle. The calculated non-recoverable creep strains are also used to estimate the fatigue lifetime of a joint. Results suggest that the lifetime of ICA joints is influenced less by non-recoverable strain than the lifetime of tin-lead solder joints.
{"title":"Modelling of ICA creep properties","authors":"O. Rusanen","doi":"10.1109/ADHES.2000.860597","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860597","url":null,"abstract":"Flip chip bonding with isotropically conducting adhesives is gaining in popularity since it can simplify and reduce the cost of the interconnecting process. To effectively estimate the reliability of ICA flip chip joints, one needs to model the viscoelastic behaviour of the adhesives. Creep is an important property because it enables stress relaxation through non-recoverable strain. Ignoring ICA creep in FE-simulations will result in overestimation of stress and underestimation of strain in a joint. This paper proposes that ICAs can be modelled as a Maxwell element to calculate creep compliance rates. The creep compliance rates are needed for simulating stress-strain hysteresis curves during a thermal cycle. The calculated non-recoverable creep strains are also used to estimate the fatigue lifetime of a joint. Results suggest that the lifetime of ICA joints is influenced less by non-recoverable strain than the lifetime of tin-lead solder joints.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"74 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125994424","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860616
P. Savolainen
It has been estimated recently that within few years there will be more wireless terminals connected to the Internet and related services than there will be fixed equipment (desktop PCs, etc.). This means that the portable equipment needs high performance and high functionality combined with small size and low energy consumption, all this at low cost. Inevitably, very high packaging efficiency is needed and new packaging and substrate technologies will be required. Area array packages, especially chip scale package and flip chip, can provide minimal package size but the new packages require much higher routing capability from the substrates than before. New substrate technologies, such as microvia printed wiring boards have actively been developed in the last years, and they can meet the challenges for some time. However, with the fast integrated circuit development, there is clearly demand for technologies that give the solutions for the future.
{"title":"Advanced substrates for wireless terminals","authors":"P. Savolainen","doi":"10.1109/ADHES.2000.860616","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860616","url":null,"abstract":"It has been estimated recently that within few years there will be more wireless terminals connected to the Internet and related services than there will be fixed equipment (desktop PCs, etc.). This means that the portable equipment needs high performance and high functionality combined with small size and low energy consumption, all this at low cost. Inevitably, very high packaging efficiency is needed and new packaging and substrate technologies will be required. Area array packages, especially chip scale package and flip chip, can provide minimal package size but the new packages require much higher routing capability from the substrates than before. New substrate technologies, such as microvia printed wiring boards have actively been developed in the last years, and they can meet the challenges for some time. However, with the fast integrated circuit development, there is clearly demand for technologies that give the solutions for the future.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127919210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860566
C. Adler, G. Klink, M. Feil, F. Ansorge, H. Reichl
The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 /spl mu/m. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or even paper. Possible applications for such systems are electronic labels, tickets or security papers. For these systems different die bonding and electrical interconnection methods can be used. Dies are bonded by adhesive. Due to low topography ultra thin ICs can then be interconnected just by screen printing of polymer paste or by using the flip chip technique with anisotropic conductive adhesive. The paper describes new fundamentals for interconnection of ultra thin ICs and systems to flexible substrates. Accurate dosing of adhesive for die bonding with a thickness of adhesive of approx. 5 micron was developed. Solutions for handling of ultra thin and flexible ICs was found. An optimal process flow was developed by investigations at different types of substrates (paper, polymer foil, electronic flex substrates), different adhesives (epoxy, cyanacrylates) deposition methods (dispensing, stamping and dipping) and interconnection techniques. The properties of the assembled test systems, in due to reliability under mechanical and thermo mechanical stresses have been evaluated and are discussed.
{"title":"Assembly of ultra thin and flexible ICs","authors":"C. Adler, G. Klink, M. Feil, F. Ansorge, H. Reichl","doi":"10.1109/ADHES.2000.860566","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860566","url":null,"abstract":"The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 /spl mu/m. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or even paper. Possible applications for such systems are electronic labels, tickets or security papers. For these systems different die bonding and electrical interconnection methods can be used. Dies are bonded by adhesive. Due to low topography ultra thin ICs can then be interconnected just by screen printing of polymer paste or by using the flip chip technique with anisotropic conductive adhesive. The paper describes new fundamentals for interconnection of ultra thin ICs and systems to flexible substrates. Accurate dosing of adhesive for die bonding with a thickness of adhesive of approx. 5 micron was developed. Solutions for handling of ultra thin and flexible ICs was found. An optimal process flow was developed by investigations at different types of substrates (paper, polymer foil, electronic flex substrates), different adhesives (epoxy, cyanacrylates) deposition methods (dispensing, stamping and dipping) and interconnection techniques. The properties of the assembled test systems, in due to reliability under mechanical and thermo mechanical stresses have been evaluated and are discussed.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134487508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860594
J. Taweeplengsangsuke, R. Pearson
Underfill resins are used to reduce the solder fatigue in flip-chip assemblies. Both the underfilling and the curing process are crucial to the reliability of the finished products. A variety of techniques have been used to characterize the essential phenomena governing the processing of underfill resins. Such phenomena include wetting, flow behavior, cure kinetics, cure stresses, outgassing phenomena and void formation. We will show that processing diagrams for underfill resins can be developed based on these fundamentals and provide guidelines for the underfilling and curing steps. With such processing diagrams one should be able to design the underfilling and curing process using a scientific approach that allows one to save time and money from the usual trial and error method.
{"title":"Development of processing diagrams for underfill resins","authors":"J. Taweeplengsangsuke, R. Pearson","doi":"10.1109/ADHES.2000.860594","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860594","url":null,"abstract":"Underfill resins are used to reduce the solder fatigue in flip-chip assemblies. Both the underfilling and the curing process are crucial to the reliability of the finished products. A variety of techniques have been used to characterize the essential phenomena governing the processing of underfill resins. Such phenomena include wetting, flow behavior, cure kinetics, cure stresses, outgassing phenomena and void formation. We will show that processing diagrams for underfill resins can be developed based on these fundamentals and provide guidelines for the underfilling and curing steps. With such processing diagrams one should be able to design the underfilling and curing process using a scientific approach that allows one to save time and money from the usual trial and error method.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133799048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
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