{"title":"A new test structure to study electromigration at grain boundaries using the single-crystal aluminum interconnection","authors":"K. Kusuyama, Y. Nakajima, Y. Murakami","doi":"10.1109/ICMTS.1995.513977","DOIUrl":null,"url":null,"abstract":"The new test structure with single-crystal aluminum interconnection made by the lateral-epitaxial growth method, was designed to study electromigration (EM) at grain boundaries in bamboo structure. Having only two bamboo grain boundaries, the EM mechanism can be analyzed more accurately by this new structure than using the ordinary structure of series of grain boundaries.","PeriodicalId":432935,"journal":{"name":"Proceedings International Conference on Microelectronic Test Structures","volume":"550 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1995.513977","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The new test structure with single-crystal aluminum interconnection made by the lateral-epitaxial growth method, was designed to study electromigration (EM) at grain boundaries in bamboo structure. Having only two bamboo grain boundaries, the EM mechanism can be analyzed more accurately by this new structure than using the ordinary structure of series of grain boundaries.
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