Smart power IC macromodeling for DPI analysis

H. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, F. Klotz, Marco Brignone, F. Fiori
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引用次数: 1

Abstract

This paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.
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用于DPI分析的智能电源IC宏建模
研究了智能电源集成电路对射频干扰的易感性。提出了一种方法来执行模拟,旨在评估在EMI存在下更复杂的集成电路中包含的子电路的性能。在此基础上,研究了在DPI测试中包含在高压电源开关中的电流传感器的行为。给出了仿真分析和DPI试验结果。
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