Identify Optical Proximity Correction (OPC) issue in 0.13 /spl mu/m technology development

Z. Mai, Benjamin Lau, G. Qian, Jian Jun Shi, R. He, Jessica Chin
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Abstract

In this paper, we explained a failure analysis methodology to identify optical proximity correction issues in 0.13 /spl mu/m technology development. Here we used, the continue-on-failure wafer sort technology for yield analysis.
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识别0.13 /spl mu/m技术开发中的光学邻近校正(OPC)问题
在本文中,我们解释了一种故障分析方法,用于识别0.13 /spl mu/m技术开发中的光学接近校正问题。在这里,我们使用持续故障晶圆分类技术进行良率分析。
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