Common Source Inductance Compensation Technique for Dynamic Current Balancing in SiC MOSFETs Parallel Operations

Boyi Zhang, R. Wang, P. Barbosa, Yu-Hsuan Tsai, Wen-Sheng Wang, Wen-Shang Lai
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Abstract

In high-current applications such as traction inverters, SiC MOSFETs are paralleled to increase the current capability. One major issue in paralleling SiC MOSFETs is the dynamic current unbalance. The unbalanced dynamic current could lead to severe device and system failures. It was well known that one of the root causes of dynamic current unbalance is parasitic parameter unbalance due to asymmetrical layout. In this paper, the impact of different parasitic parameters in circuit layout on current sharing is identified. Based on the analysis, a common source inductance (CSI) compensation technique is proposed for SiC MOSFETs in parallel operations to balance the dynamic current during the switching transient. With the proposed technique, the dynamic current among paralleled switches is evenly distributed even when the layout is not symmetrical. The improved current sharing is achieved by designing the common source inductance of each paralleled device inversely proportional to the power loop inductance. Because of the balanced dynamic current, the reliability of the circuit with the proposed layout can be significantly improved. The proposed technique is an easy-to-implement design that requires no additional components. Two types of prototypes are built to verify the proposed technique: A half-bridge configuration with SiC discrete devices in parallel and a multi-chip power module with SiC dies in parallel. The proposed technique is proven effective in both cases.
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SiC mosfet并联工作中动态电流平衡的共源电感补偿技术
在大电流应用中,如牵引逆变器,SiC mosfet并联以增加电流能力。并联SiC mosfet的一个主要问题是动态电流不平衡。不平衡的动态电流可能导致严重的设备和系统故障。众所周知,动态电流不平衡的根本原因之一是由不对称布局引起的寄生参数不平衡。本文研究了电路布局中不同寄生参数对电流分担的影响。在此基础上,提出了一种用于SiC mosfet并联工作的共源电感(CSI)补偿技术,以平衡开关瞬态过程中的动态电流。利用该技术,即使在非对称布局下,并联开关间的动态电流也能均匀分布。通过设计每个并联器件的公共源电感与功率环路电感成反比,实现了改进的电流共享。由于动态电流的平衡,该电路的可靠性得到了显著提高。所建议的技术是一种易于实现的设计,不需要额外的组件。我们构建了两种类型的原型来验证所提出的技术:一种是SiC分立器件并联的半桥结构,另一种是SiC芯片并联的多芯片功率模块。所提出的技术在这两种情况下都被证明是有效的。
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