Varistor-type bidirectional switch (JMAX>107A/cm2, selectivity∼104) for 3D bipolar resistive memory arrays

Wootae Lee, Jubong Park, Jungho Shin, J. Woo, Seonghyun Kim, G. Choi, Seungjae Jung, Sangsu Park, Daeseok Lee, E. Cha, H. Lee, S. Kim, Suock Chung, H. Hwang
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引用次数: 65

Abstract

We demonstrate a varistor-type bidirectional switch (VBS) with excellent selection property for future 3D bipolar resistive memory array. A highly non-linear VBS showed superior performances including high current density (>;3×107A/cm2) and high selectivity (~104). The non-linear I-V characteristics can be explained by varistor-type multi-layer tunnel barriers, which were formed by Ta incorporation into thin TiO2. Furthermore, the 1S1R device showed excellent suppression of leakage current (>;104 reduction) at 1/2VREAD, which is promising for ultra-high density resistive memory applications.
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用于3D双极电阻式存储阵列的压敏型双向开关(JMAX>107A/cm2,选择性~ 104)
我们展示了一种具有优异选择性能的压敏型双向开关(VBS),用于未来的3D双极电阻式存储阵列。高度非线性的VBS具有高电流密度(>;3×107A/cm2)和高选择性(~104)的优异性能。非线性I-V特性可以用压敏电阻型多层隧道势垒来解释,这些势垒是由Ta掺入到薄TiO2中形成的。此外,1S1R器件在1/2VREAD下表现出优异的泄漏电流抑制(>;减小104),这在超高密度电阻式存储器应用中具有前景。
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Varistor-type bidirectional switch (JMAX>107A/cm2, selectivity∼104) for 3D bipolar resistive memory arrays Segmented-channel Si1−xGex/Si pMOSFET for improved ION and reduced variability High performance bulk planar 20nm CMOS technology for low power mobile applications Conductive filament scaling of TaOx bipolar ReRAM for long retention with low current operation Strain-induced performance enhancement of tri-gate and omega-gate nanowire FETs scaled down to 10nm Width
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