Substrate-less oscillator module realized by gap waveguide technology for millimeter wave applications

Abstract

A novel substrate-less oscillator module realized by gap waveguide technology is proposed in Ka band. No substrate is used in the RF section of the implemented oscillator and the whole structure is made by machining a piece of metal. The oscillator was made of three pieces and was assembled easily without needing a precise contact between them. Active device and the resonator of the oscillator are stacked in different layers. The fabricated oscillator module is self-packaged and doesn't need any packaging. It is shown that simulated and measured results are in good agreements. This paper is a step forward to shows the capability of the gap waveguide technology for implementing the whole RF front-end in microwave and millimeter wave systems.