{"title":"Electro-optical sensor packaging overview","authors":"T. Li","doi":"10.1109/SOUTHC.1994.498088","DOIUrl":null,"url":null,"abstract":"This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment \"transparently\" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.","PeriodicalId":164672,"journal":{"name":"Conference Record Southcon","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record Southcon","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1994.498088","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment "transparently" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.
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