New X-Ray Tubes for Wafer Level Inspection

Abstract

Today's consumers are looking for powerful, multifunctional electronic devices with unprecedented performance and speed, yet small, thin and low cost. This creates complex technology and manufacturing challenges for semiconductor companies as they look for new ways to achieve greater performance and functionality in a small, thin, low cost device. JCET is an industry leader in Wafer Level Packaging (WLP) technology, providing a comprehensive portfolio of WLP solutions including Fan-in Wafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP) and Integrated Passive Devices (IPD This paper shares data and results from our labs and those of our technology partners which come from two recent tube technology advances, both show great potential for providing solutions to the issues of imaging small features quickly, faced in the higher end semiconductor manufacturing industry. Metal Jet Technology, in metal jet anode microfocus xray tubes the traditional solid metal anode is replaced with a jet of liquid metal, which acts as the electron-beam target, The metal jet supports higher electron-beam power and can therefore generate higher X-ray flux. The major benefit of the increased power density level for the metal-jet X-ray tube is the possibility to operate with a smaller focal spot, say 5 ?m, to increase image resolution and at the same time acquire the image faster, since the power is 10x higher for same spot size. Which means that a 5μm spot on a Metal Jet can tolerate approximately 5x higher power compared to a 10μm spot on a tube with a traditional solid filament This technology delivers one of the smallest and most intensive X-ray beams of any Xray source to meet the ever-increasing technology demands, including wafer level package inspection. Nano Tube Technology This enables industry-leading resolution in geometric magnification, the Nano tube is based on advanced electron optics and the latest tungsten-diamond transmission target technology. Automatic e-beam focusing, and astigmatism correction ensures that the smallest possible, truly round spot is achieved. The Nano tube also has the unique feature of internally measuring and reporting the current spot size. In addition, advanced cooling and thermal design results in extreme stability over time. This enables an unprecedented true resolution of 150 nm lines and spaces. The true round spot of the tube is demonstrated by the highly symmetric images of a ‘Siemens star’ resolution target, the innermost features are 150 nm